INTEGRATED CIRCUITS

50 INR/Piece

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Product Details:

Power Supply DC
Features Miniaturized, high reliability, low power consumption, multi-functionality
Usage Used in electronic devices and embedded systems
Thermal Conductivity Low to moderate, requires heatsink for high-power ICs
Interface Pin or surface mount
Power Source External DC supply
Processor Speed Up to 200 MHz (for standard logic ICs)
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Product Description

INTEGRATED CIRCUITS Price And Quantity

Minimum Order Quantity 50 Piece
Price 50 INR/Piece

INTEGRATED CIRCUITS Product Specifications

Power Source External DC supply
Application Industrial, automotive, consumer electronics, telecommunications, instrumentation
Interface Pin or surface mount
Features Miniaturized, high reliability, low power consumption, multi-functionality
Function Performs signal processing, amplification, logic, or memory operations in electronic circuits
Dimension (L*W*H) 12mm x 5mm x 3mm (varies per IC type)
Frequency DC to several hundred MHz (depends on IC type)
Capacity Depends on function (e.g., storage, computation)
Color Black
Current Rating 10-100 mA (depends on IC design)
Power Supply DC
Rated Voltage 5V DC
Operating Temperature -40C to +85C (standard industrial range)
Components Semiconductor substrate, pins, encapsulation material
Input Varies depending on IC type (digital, analog, mixed-signal)
Weight Approx. 1-5 grams per unit
Supply Voltage 3V to 12V (depends on IC family)
Size Standard (e.g., DIP, SOP, SMD packages)
Usage Used in electronic devices and embedded systems
Thermal Conductivity Low to moderate, requires heatsink for high-power ICs
Processor Speed Up to 200 MHz (for standard logic ICs)
Output Varies depending on IC type (digital, analog, mixed-signal)
Response Time Nanoseconds to microseconds (depends on IC type)
Product Type Integrated Circuits
Thickness 3 mm (Typical IC body thickness)

INTEGRATED CIRCUITS Trade Information

Payment Terms Cash Against Delivery (CAD), Cash in Advance (CID)
Main Domestic Market All India

Product Description

The MAXIM Integrated Circuit (IC) is a high-performance IC that provides a wide range of benefits, such as low power consumption, high precision, and excellent signal integrity. It is designed for use in a variety of applications, including data acquisition, medical devices, automotive, industrial control, and communication systems. This MAXIM INTEGRATED CIRCUIT also includes advanced features, such as built-in diagnostics, fault protection, and self-calibration, which ensure reliable and accurate performance. Additionally, its compact size and low cost make it an attractive choice for space-constrained and cost-sensitive applications. systems.

Versatile Mounting and Reliable Operation

Offering both through-hole and surface-mount options, these integrated circuits are suitable for a vast range of applications. The robust enclosure (plastic or ceramic) and integrated ESD protection enhance durability, while the devices are available in multiple pin counts and packages to accommodate various design requirements. This versatility makes them optimal for use in environments ranging from consumer electronics to industrial instrumentation.

High Performance with Enhanced Safety

Each IC is made with silicon semiconductor technology and is protected by integrated ESD circuits. RoHS compliance and tin-plated leads ensure safety standards are met, while the devices operate reliably within a wide temperature range (-40C to +85C). The thermal characteristics and moisture sensitivity are tailored for Indian climatic conditions, maintaining optimal performance across diverse conditions.

FAQs of INTEGRATED CIRCUITS:

Q: How are these integrated circuits typically mounted onto circuit boards?

A: These ICs are designed for both through-hole and surface mount (SMD, SOP, DIP) installation. The mounting configuration depends on the specific package type selected, allowing compatibility with either soldering directly onto PCB pads or using pin insertion through holes.

Q: What benefits does integrated ESD protection offer in these ICs?

A: Integrated ESD protection circuitry safeguards the ICs against electrostatic discharge, reducing the risk of damage during manufacturing and handling. This enhances device reliability and ensures stable operation across a wide range of environments.

Q: When should I consider using a heatsink with these ICs?

A: A heatsink may be necessary for high-power ICs or when the device operates near the upper end of its rated current or frequency range (up to several hundred MHz). For low- to moderate-power applications, the devices thermal characteristics usually suffice without additional cooling.

Q: Where are these ICs commonly used in electronic systems?

A: These integrated circuits are widely used across various sectors, including industrial automation, automotive electronics, consumer devices, telecommunications equipment, and instrumentation. Their versatility and compactness make them ideal for embedded systems and multirole applications.

Q: What is the typical process for selecting the suitable IC package type?

A: Selection is based on the applications circuit design, space constraints, required pin count, and assembly method. Surface mount packages offer compactness for automated manufacturing, while through-hole packages are favored for prototyping and environments requiring enhanced mechanical stability.

Q: How do these ICs contribute to the performance of electronic devices?

A: By performing crucial functions such as signal processing, amplification, logic, or memory operations, these ICs support the efficient operation of electronic circuits. Their high speed (up to 200 MHz), low power consumption, and integrated protection features make them integral to innovative system designs.

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